Die sorting,blue tape die tape and reel machine from wafer testing machine Watch Video
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Description: Die sorter, semiconductor pick and place machine, die packaging, wafer to wafer, wafer to waffle pak, wafer to tape and reel machinen1. Can be used with 6-inch/8-inch Wafer ring input and tapen2. Pick with one nozzle from wafer ring to carrier tape;n3. Mapping function is optional;n4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;n5. Suitable for QFN, CSP etc;n6. Carrier tape rail width fixed. One machine is for one spec carrier tape only;n7. HMI software has English languagennWafer to dicing ta
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